Send Message

Dongguan MENTO Intelligent Technology Co., Ltd. info@mento-mv.com 00-86-13410031559

Dongguan MENTO Intelligent Technology Co., Ltd. Company Profile
products
Home > products > 3D AOI Machine > K3412 High-Efficiency 3D AOI Machine for Solder Joint and Device Inspection

K3412 High-Efficiency 3D AOI Machine for Solder Joint and Device Inspection

Product Details

Place of Origin: DONGGUAN

Brand Name: MENTO

Certification: FCC.ROHS,CCC

Model Number: K3412

Payment & Shipping Terms

Minimum Order Quantity: 1

Packaging Details: W1000mmxD1380mmxH1600mm(without foot 100±20mm)

Delivery Time: 30work days

Supply Ability: 1000PCS/M

Get Best Price
Product Details
Highlight:

High Efficiency 3D AOI Machine

,

Device Inspection 3D AOI Machine

,

3D AOI Machine for Solder Joint

Pcb Size:
Max. 500mm X 500mm
Inspection Type:
Automated
Light Source:
LED
Inspection Speed:
1000mm/s
Camera System:
3D Digital Camera
Resolution:
10μm
Lighting System:
LED
Alignment Method:
Automatic Alignment
Lighting:
RGB LED
Inspection Accuracy:
±5μm
Power Supply:
AC 220V, 50/60Hz
Aoi:
Automated
Operating System:
Windows 10
Dimension:
1000mm X 800mm X 1500mm
Inspection Area:
Up To 510 X 510 Mm
Pcb Size:
Max. 500mm X 500mm
Inspection Type:
Automated
Light Source:
LED
Inspection Speed:
1000mm/s
Camera System:
3D Digital Camera
Resolution:
10μm
Lighting System:
LED
Alignment Method:
Automatic Alignment
Lighting:
RGB LED
Inspection Accuracy:
±5μm
Power Supply:
AC 220V, 50/60Hz
Aoi:
Automated
Operating System:
Windows 10
Dimension:
1000mm X 800mm X 1500mm
Inspection Area:
Up To 510 X 510 Mm
Product Description

Application scope

Solder joint and mounted device inspection

 

Features

1.High speed, single FOV processing time is about 350ms

2.Anti-interference, high precision, large range

3.RGB light source seamlessly integrates 2D information to enhance judgment accuracy

4.Three-dimensional height visualization, which can display three-dimensional RGB data and height heat maps

 

Technical parameter

Device model K3412
Detection capacity Detection items Miss print, over solder, insufficient solder, solder bridging, solder paste tailing, shape anomany, offset
Scanning method Stop&Go
Optical system Camera 12MP high-speed color industrial camera
Light Source 4 DLP light source (raster phase shift technology) and red, green and blue (RGB) light source
Resolution 10μm & 15um (optional)
Detection performance Height accuracy (calibration module) 1μm (using standard calibration block)
Volume repeatability <1% (standard verification block, 3Sigma)
Maximum Plate Bending Compensation Value ±3mm
Detection Capability GRR <10%at6o(+50%tolerance, 5μm resolution)
Maximum detection height 20mm/40mm
Solution to shadow problem Grating phase shifting technology to eliminate shadows & four-directional 3D light source illumination system
Plate bending real-time compensation method Plate Bend Compensation (Z-Tracking+Pad Referencing)
Test screen Color (3D and 2D images displayed together)
Driving equipment Servomotor+Screw Guide
Moving speed 800mm/s
Minimum measurable product size 50mmx50mm
Maximum product measurable size 400mmx500mm
PCB thickness 0.5~6mm
Track width adjustment Automatic width adjustment, manual width adjustment
Circuit board conveying/fixing Belt conveyor/pneumatic clamp fixing
Conveying direction From left to right, right to left
Orbital height 900±20mm
Computer Configuration Mainframe CPU: Intel i5, RAM: DDR4-16G, GPU: GTX1660-6GB, SSD:250G, HDD: 2T
Monitor 22"LED
Operating system Ubuntu
Parameters Overall size W1000xD1380xH1600mm (excluding alarm light)
Weight 1100KG
Power source AC220V/50~60Hz/2000W
Air Pressure 0.5Mpa
Software Supported Input Formats Support Gerber format (274X), ODB++
Environmental requirements Temperature: 5~40℃, relative humidity: 25%~80% (no frost)
Upstream and downstream equipment communication Standard SMEMA interface